Next-Generation Semiconductor Wafer Wet Cleaning Technology Solutions
Engineered for high-yield wafer fabrication, our single wafer cleaning systems, batch wet benches, and scrubbers deliver ultra-high particle removal efficiency (PRE) across critical process nodes.
Leveraging years of semiconductor equipment R&D experience, KOSEN SEMI provides highly reliable wet process technology and equipment support for advanced global wafer fabs. Learn more about us and our core focus.
200 nm
Standard Particle Control; 100 nm Optimized
200 / 300mm
Supported Wafer Sizes
0%
Pattern Collapse Rate
Wafer Compatibility
200mm / 300mm
Target Applications
Wafer Fabs & OSATs
Full-Scenario Semiconductor Wet Cleaning Equipment Portfolio
KOSEN SEMI's equipment matrix covers full-process cleaning requirements from front-end FEOL to back-end BEOL. By focusing on advanced semiconductor innovation, our modular wafer-cleaning-systems equipment line delivers maximum yield and micro-contamination control. Learn more on our about-us page.
Single Wafer Cleaning System
Precision single-wafer spin technology providing fine microscopic particle control while minimizing cross-contamination for semiconductor fabrication.
Key Capabilities
- Fine microscopic particle control
- Extremely low cross-contamination
- Precise spin spray chemistry delivery
Batch Wet Bench System
Automated batch wet bench solution engineered for high-volume manufacturing. Maximizes chemical recirculation while reducing total cost of ownership.
Key Capabilities
- High-throughput batch processing
- Optimized chemical utilization rate
- Fully automated robotic handling
Scrubber Cleaning System
High-efficiency double-sided and single-sided wafer scrubber equipment. Removes post-CMP residue and particle defects through physical scrubbing and megasonics.
Key Capabilities
- Single/double-sided mechanical scrubbing
- Megasonic non-contact particle removal
- Post-CMP residue removal
Breakthrough Micro and Nano Particle Removal and Surface Cleaning Technology
High-yield wafer fabrication demands exceptional particle removal efficiency while protecting delicate circuit features. KOSEN SEMI delivers semiconductor wafer cleaning systems engineered for demanding process applications. By integrating precision megasonic physical agitation, dynamic chemical micro-dosing, and surface-tension-engineered IPA drying, our systems control particles at 200 nm under standard conditions and down to 100 nm under optimized conditions while reducing pattern-collapse and surface-oxidation risks across complex 3D architectures.
Megasonic Cavitation
Controlled acoustic field distribution controlling particles at 200 nm under standard conditions and down to 100 nm under optimized conditions while minimizing the risk of mechanical structural damage.
RCA Chemical Control
Closed-loop dynamic chemical micro-dosing maintaining SC1 and SC2 process windows and ultra-precise HF etch rates.
Marangoni Super Drying
Surface tension gradient optimization coupled with vaporized IPA to reduce pattern-collapse and watermark risks.
Surface Conditioning
Tailored hydrophilicity and hydrophobicity tuning to protect fragile high-aspect-ratio polysilicon and metal lines.
Precision Acoustic Cavitation and Megasonic Energy Control
Conventional ultrasonic cleaning methods introduce erratic acoustic cavitation that can shatter delicate gate structures, fragile high-aspect-ratio fins, and microscopic interconnects. KOSEN SEMI's advanced megasonic cleaning technology utilizes a proprietary multi-frequency megasonic generator operating in the megahertz spectrum. By generating stable, uniform micro-cavitation bubbles, sound energy gently transfers momentum directly to particles at 200 nm under standard conditions and down to 100 nm under optimized conditions.
This controlled physical disruption breaks the boundary layer adhesion forces holding metallic, organic, and slurry particles onto the substrate surface. The system maintains continuous power uniformity across 200mm and 300mm wafers, suppressing energy hot spots and ensuring repeatable high-yield particle removal efficiency across advanced process nodes, including our specialized Single Wafer Cleaning Systems.
- 200 nm Standard / 100 nm Optimized Particle Removal: Dislodges microscopic slurry residue and airborne contaminants without physical contact.
- Low Structural Damage Risk: Acoustic field modulation helps prevent pattern shedding on fragile line geometries.
- Uniform Energy Distribution: Custom piezoelectric transducers support consistent active-zone coverage with minimized shadow zones.
Performance Metric
Particle removal performance validated at 200 nm under standard conditions and down to 100 nm under optimized conditions
Process Window
Dynamic chemical thermal precision controlled within ±0.1°C
Dynamic Chemical Process Window and RCA Cleaning Systems
Chemical reactions in semiconductor wet cleaning require strict control over bath temperature, chemical concentration, and flow dynamics. KOSEN SEMI incorporates an advanced chemical micro-dosing delivery architecture coupled with real-time inline concentration sensors. This keeps standard RCA sequences (SC1 ammonium hydroxide/hydrogen peroxide mixtures and SC2 hydrochloric acid/hydrogen peroxide mixtures) operating precisely within their optimal kinetic windows.
For oxide etching, polymer residue removal, and native oxide stripping, our dilute hydrofluoric acid (DHF) and sulfuric acid-peroxide mixture (SPM) control modules maintain linear etch rates and prevent unwanted surface roughness. Chemical recirculation loops reduce chemical consumption while minimizing ionic contamination across front-end and back-end wafer processing.
- Micro-Dosing Accuracy: Dynamic chemical injection prevents ratio drift during continuous high-throughput production runs.
- Contamination Prevention: Closed-loop chemical delivery prevents cross-contamination and ionic trace buildup.
- Thermal Stability: Precision heat exchangers maintain process fluids at target setpoints without temperature spiking.
Marangoni Surface Tension Control and Pattern Collapse Prevention
As aspect ratios in advanced 3D NAND, FinFET, and GAA structures exceed 50:1, surface tension forces during liquid drying cause severe pattern collapse and watermark defects. Standard spin drying leaves liquid menisci between narrow lines, creating capillary forces that pull microscopic walls together and destroy structural integrity.
KOSEN SEMI's proprietary IPA megasonic and Marangoni super drying technology replaces liquid surface boundaries with an isopropyl alcohol vapor gradient. By lowering surface tension during liquid displacement, the wafer dries rapidly with reduced capillary force. The process reduces watermark and pattern-collapse risks while supporting high surface cleanliness within the 200 nm standard and 100 nm optimized capability range.
- Pattern Collapse Prevention: Protects ultra-high aspect ratio structures during critical drying steps.
- Reduced Watermark Defects: Controlled displacement of deionized rinse water helps prevent silica deposition spots.
- Reduced IPA Consumption: Vaporized injection minimizes chemical usage while maximizing process speed.
Drying Integrity
Low pattern-collapse risk on structures with aspect ratios up to 60:1
Advanced Cleaning Technology Comparison Matrix
Quantitative comparison of conventional cleaning methods versus KOSEN SEMI advanced wet process technology.
| Performance Vector | Standard Spin Cleaning | Conventional Ultrasonic Drying | KOSEN SEMI Wet Process |
|---|---|---|---|
| Particle Removal (standard ≥200 nm; optimized ≥100 nm) | Application dependent | Application dependent | Validated per process |
| Pattern Collapse Risk (High Aspect Ratio) | High Risk | Moderate Risk | Low Collapse Risk |
| Watermark Defect Density | Moderate level | Low level | Low Defect Level |
| Chemical Dosing Precision | ±5.0% | ±2.5% | ±0.5% Micro-Dosing |
| Substrate Feature Damage Rate | Low Damage | Cavitation Damage | Low Damage Risk |
KOSEN SEMI Self-Developed Megasonic and IPA Drying Architecture
Engineered and manufactured under rigorous quality control standards, learn more about us and how KOSEN SEMI's self-developed megasonic generator and IPA drying technology support microstructure integrity and long-term process repeatability for semiconductor fabs.
Cleaning Applications Across the Semiconductor Manufacturing Process
Integrating high-precision semiconductor wafer cleaning systems into core process modules supports yield enhancement across FEOL, BEOL, and packaging processes. KOSEN SEMI leverages its specialized engineering capability to design scalable wet processing platforms intended to mitigate contamination risks, control micro-particulates, and safeguard delicate geometries across modern wafer fabrication.
Lithography Cleaning & Substrate Surface Modulation
Photolithography demands ultra-stringent particle control and precise substrate surface conditioning to prevent defects. Organic residues remaining after photoresist stripping or surface pre-treatment disrupt coating uniformity and cause micro-bridging across fine features. Tailored lithography cleaning processes eliminate microscopic impurities while precisely controlling surface hydrophilicity and hydrophobicity to maximize resist adhesion.
KOSEN SEMI single-wafer cleaning systems combine precise SC1 chemical micro-dosing with controlled megasonic agitation. This targeted physical-chemical mechanism controls organic contaminants at 200 nm under standard conditions and down to 100 nm under optimized conditions while minimizing risks to critical line dimensions and fragile patterns. Coupled with advanced IPA Marangoni drying, our systems reduce watermark formation and support clean wafer surfaces for subsequent exposure steps.
Key Technical Features
- •Dynamic organic residue stripping using micro-dosed SPM and SC1 chemistries.
- •Tunable substrate surface hydrophilicity for optimized photoresist adhesion.
- •Reduced structural-degradation risk within the 200 nm standard and 100 nm optimized capability range.
Frequently Asked Questions on Semiconductor Wet Cleaning Technology
Get clear, engineer-verified answers to common technical queries regarding wafer cleaning systems, chemical management, and yield optimization. KOSEN SEMI provides comprehensive semiconductor wet bench FAQ guidance, sample testing, and on-site fab verification to help you select the precise wet process solution for your line. Learn more about our advanced Engineering Capability in supporting next-generation fab requirements.
Still Have Questions About Your Wafer Cleaning Process?
KOSEN SEMI's wet process engineering team is available to analyze your specific contamination profiles, process nodes, and throughput requirements. Contact us to request custom technical evaluations, sample cleaning tests, or on-site fab verification.