High-Precision Industrial Chemical Cleaning Equipment
Automated Wet Chemical Cleaning & Surface Treatment Systems Engineered for Semiconductor, Optoelectronics, and Microelectronics Manufacturing.
KOSEN SEMI delivers ultra-pure precision process cleaning solutions, combining corrosion-proof architectures and advanced automation to maximize yields in critical micro-manufacturing environments worldwide. Learn more about us and our commitment to semiconductor fabrication excellence.
Engineered for Extreme Wet Chemical Processing Environments
KOSEN SEMI manufactures high-precision chemical cleaning equipment engineered to withstand aggressive wet chemical processing environments. Our advanced wet cleaning architectures unify broad chemical compatibility, automated cleaning systems, precise thermal control, and multi-tiered safety containment to maximize process yield and operational safety.
From concentrated hydrofluoric acid etching to solvent-based photoresist stripping, our wafer cleaning systems maintain continuous multi-shift stability and repeatable particle performance. Discover how our proprietary corrosion-resistant hardware and closed-loop process controls enhance tool uptime, optimize chemical consumption, and safeguard fab personnel.
Advanced Corrosion Resistance
Full PFA, PVDF, and Natural Polypropylene (NPP) structural wetted parts engineered to resist aggressive acid and solvent matrices, effectively tripling tank operational lifespan.
Precision Thermal & Recirculation Control
Closed-loop PID inline fluid heating paired with continuous sub-micron filtration filters. Delivers uniform bath temperatures and active particulate extraction during intensive bath processing.
Ultrasonic & Megasonic Chemical Cleaning
Multi-frequency ultrasonic chemical cleaning and megasonic cavitation systems engineered to remove 200 nm-class contaminants, with optimized capability down to 100 nm from high-aspect-ratio micro-structures and blind vias.
Closed-Loop Safety Containment
Integrated N2 blanket purging, active VOC exhaust monitoring, and multi-tiered hardware safety interlocks prevent hazardous vapor accumulation and chemical exposure risks.
Wetted Material Compatibility & Structural Integrity
Ensuring total chemical compatibility across aggressive acid, solvent, and alkaline chemistries is paramount for zero-defect manufacturing. Our specialized engineering capability utilizes virgin-grade fluoropolymers engineered to eliminate stress cracking, trace elemental leaching, and chemical degradation under continuous high-temperature bath operations.
- PFA & PVDF Structural Components: Delivers exceptional chemical purity with zero ion leaching during aggressive SC1, SC2, SPM, and hydrofluoric acid operations.
- Natural Polypropylene (NPP): Provides superior structural rigidity and chemical inertness for high-capacity alkaline and detergent cleaning stages.
- Seamless Thermoplastic Fusion Welds: Precision-welded tank seams eliminate structural dead zones and reduce 200 nm-class particulate entrapment, with optimized control down to 100 nm.
Automated Process Control & Integrated Safety Architecture
Modern automated cleaning systems must pair uncompromising process consistency with robust operator safety. KOSEN SEMI integrates industrial PLC automation with multi-layered safety containment architectures, enabling precise chemical dosing control and risk-free wet processing.
Automated Chemical Dosing Control
Precision closed-loop metering pumps and inline chemical concentration sensors automatically adjust bath composition to maintain exact chemical ratios.
Active VOC Vapor Extraction
Differential pressure airflow sensors and continuous VOC exhaust monitoring ensure complete exhaust velocity before enabling fluid heating or acoustic agitation.
High-Speed Safety Dump Valving
Automated pneumatic emergency dump valves rapidly evacuate process chemistry into isolated containment tanks upon detection of thermal or fluid anomalies.
Uncompromising Wet Process Equipment Reliability
KOSEN SEMI's proprietary anti-corrosion fluid controls and closed-loop safety architecture guarantee multi-shift stability under high-stress chemical processing environments.
Wafer Surface Purity, Etching & Contaminant Remediation
KOSEN SEMI manufactures high-yield semiconductor cleaning equipment tailored to eliminate trace metallic contamination, organic residues, and 200 nm-class particulate matter, with optimized removal down to 100 nm down to parts-per-trillion (ppt) levels. Engineered for 150mm, 200mm, and 300mm wafer cleaning systems with exact chemical dosing and precise temperature control. To learn more about our Engineering Capability, visit our specialized technological overview.
- • Photoresist Stripping & SPM: Complete organic film stripping and cross-linked resist removal using SPM or solvent chemistry without substrate degradation.
- • Organic Contaminant Remediation: Targeted aqueous ozone (O3) and solvent baths designed for critical FEOL and BEOL surface conditioning.
- • Controlled Precision Etching: Isotropic wet chemical etching delivering uniform layer removal across silicon, oxide, and compound semiconductor wafers.
- • Post-CMP Slurry Removal: Megasonic-assisted detachment combined with cascading ultra-pure water (UPW) rinsing for zero-defect wafer surfaces.
Process Specifications and Chemical Agent Compatibility
| Process Step | Chemical Matrix | Temperature Range | Key Substrates |
|---|---|---|---|
| SC-1 Clean (Standard Clean 1) | NH4OH / H2O2 / Ultra-Pure Water | 45°C to 70°C | Silicon, GaAs, InP Substrates |
| SC-2 Clean (Standard Clean 2) | HCl / H2O2 / Ultra-Pure Water | 50°C to 80°C | Silicon Wafers & Oxide Layers |
| Controlled Oxide Etch | Dilute Hydrofluoric Acid (DHF) | 20°C to 25°C | SiO2, Quartz, Thermal Oxide |
Flexible Chemical Cleaning Equipment Architecture
From lab-scale qualification to high-volume cleanroom manufacturing, KOSEN SEMI delivers scalable wet process systems tailored to your throughput, automation, and footprint requirements. Discover our complete line of advanced products designed for demanding applications.
Single-Tank Manual & Semi-Auto Systems
Ideal for R&D labs, prototype qualification, and specialized low-volume production requiring a compact single tank cleaning system setup with maximum process flexibility, engineered alongside our specialized wafer-cleaning-systems.
Multi-Stage Inline Cleaning Systems
Designed for high-yield manufacturing, combining chemical etching, acid wash, cascade DI water rinsing, and IPA drying into a continuous multi-stage inline cleaning workflow.
Fully Automated Gantry & Robotic Lines
Fully enclosed, SEMI S2-compliant fab lines featuring automated chemical dosing, robotic material transfer, and zero-operator chemical contact for every batch chemical system.
Automated Chemical Dosing and Waste Minimization
KOSEN SEMI intelligent chemical management systems reduce raw chemistry consumption while meeting stringent global environmental compliance standards. By integrating continuous fluid monitoring, explosion proof cleaning system architecture, and ultra-pure recirculation filtration, our wet process equipment delivers precise chemical dosing control and maximum chemical solution life extension for demanding semiconductor, PCB, and microelectronics fabrication environments. Learn more on our Engineering Capability page.
Auto Dosing and Real Time Monitoring
High-precision conductivity and inline concentration sensors dynamically detect chemical bath degradation, triggering automatic inline replenishment without operator intervention. Integrated closed-loop feedback loops preserve continuous chemistry balance, ensuring reproducible process yields and eliminating manual chemical handling hazards in cleanroom environments.
Recirculation and Extended Bath Life
Continuous multi-stage particle filtration extends active chemical bath life by up to 40 percent. Seal-less magnetic drive pumps continuously cycle aggressive process fluids through sub-micron PFA filter cartridges to trap micro-particulate debris, preventing particle redeposition on sensitive wafer and optical surfaces.
Segregated Waste Streams
Dedicated multi-channel drain lines automatically isolate concentrated acids, alkalis, and organic solvents at the point of discharge. Isolating incompatible chemistries prevents hazardous exothermic reactions, drastically lowers effluent treatment complexity, and minimizes municipal compliance overhead.
Advanced IPA and Vapor Drying
Surface tension IPA drying combined with megasonic agitation prevents water spotting and chemical residue on high aspect ratio microstructures. Integrated nitrogen blanket purging and continuous VOC exhaust monitoring ensure absolute safety inside the enclosed explosion proof cleaning system cabinet.
Operational ROI Metrics
Quantifiable resource efficiency and process optimization metrics engineered into every KOSEN SEMI chemical management unit.
Fluid Recirculation Architecture
Sustainable Chemical Management for Modern Wet Processing
Managing aggressive chemistries in microelectronics fabrication requires strict adherence to operating budgets and safety protocols. Traditional chemical bath replenishment methods rely on manual dosing and fixed-schedule bath dumps, leading to excessive chemical consumption, elevated hazardous waste output, and inconsistent process outcomes. KOSEN SEMI addresses these challenges through integrated chemical dosing control that continuously samples bath concentration and adjusts chemical ratios dynamically.
Our recirculation filtration units utilize multi-stage sub-micron filter vessels paired with corrosion-proof PFA fluid lines to maintain ultra-clean bath environments over extended production runs. In volatile solvent applications, our explosion proof cleaning system cabinet includes active nitrogen inerting, continuous VOC exhaust monitoring, and multi-tiered hardware safety interlocks to protect operators and cleanroom facilities while maximizing production uptime and yield.
Enterprise Quality & Cleanroom Compliance
Every KOSEN SEMI system undergoes rigorous factory acceptance testing (FAT) in certified manufacturing facility cleanroom environments prior to site integration. We deliver validated cleanroom chemical washing systems built for SEMI S2 compliance to eliminate contamination risk for high-volume semiconductor fabs.
1,000+
Systems Deployed
Proven field reliability across worldwide microelectronics fabrication facilities.
99.8%
Operational Uptime
Continuous 24/7 high-yield chemical washing performance.
ISO Class 5–7
Cleanroom Ready
Strict particle containment meeting ISO cleanroom certification standards.
ISO 9001
Quality Certified
Rigorous quality control processes backed by specialized Engineering Capability with full component traceability.
Global Regulatory & Safety Standards
Engineered to meet stringent microelectronics standards and enterprise buyer specifications.
SEMI S2/S8 Compliance
Full verification for environmental, health, safety, and ergonomics in semiconductor manufacturing environments.
CE Marking Conformity
Certified adherence to European safety, health, and environmental protection requirements for industrial machinery.
FM Approved Components
Integrated explosion-proof components engineered specifically for hazardous cleanroom chemical washing processes.
"KOSEN SEMI's wet process equipment and advanced wafer-cleaning-systems maintained precise bath concentrations across 24/7 production runs, measurably improving our wafer yield."
Enterprise Semiconductor Manufacturer
Global Wafer Fabrication Partner
Chemical Cleaning Equipment FAQ
Navigating high-purity wet process chemical equipment requires deep engineering insight into fluid dynamics, chemical compatibility, fab safety standards, and factory automation. Browse our technical wet process chemical equipment FAQ or consult directly with KOSEN SEMI application specialists to validate chemical solution life extension strategies, safety interlocks, and custom chemical cleaner configurations for your cleanroom manufacturing facility.
Selecting the optimal wetted material for wet process chemical equipment is crucial to eliminate trace metallic contamination, prevent structural degradation, and maximize continuous bath operational lifespan. KOSEN SEMI evaluates fluid chemistry, operating temperatures, thermal cycling frequency, and micro-particle tolerance during the initial specification phase.
Engineered for concentrated hydrofluoric acid (HF), piranha etch (H₂SO₄/H₂O₂), and hot phosphoric acid. Delivers near-zero ionic extractables and thermal stability up to elevated operating temperatures.
Recommended for ambient to moderate-temperature organic acids, alkaline stripping reagents (SC1/SC2), and DI water cascade rinse tanks, delivering high rigidity and long-term mechanical reliability.
Designed specifically for flammable organic solvents, acetone degreasing, and IPA vapor drying systems where continuous electrical grounding and explosion protection are mandatory.
Every KOSEN SEMI custom chemical cleaner incorporates precision fluoropolymer welding and seamless thermal stress relief to prevent micro-cracking during rapid thermal cycling and extend bath service life.
Process Engineering Support
Have a specific process question? Talk to a wet process engineer. KOSEN SEMI's application engineering team provides custom fluid modeling, bath chemistry profiling, and compatibility verification during initial project scope reviews to eliminate risk.
Request Your Custom Wet Chemical Cleaning Solution
Provide your substrate specifications, targeted process chemistry, and throughput requirements. Backed by our advanced Engineering Capability, our team will deliver a comprehensive technical proposal within 24 hours.
High-Yield Engineering
Partner with KOSEN SEMI to develop a cost-effective, high-yield chemical wafer-cleaning-systems solution configured precisely to your process specs.
- Guaranteed response within 24 business hours
- Optimized for semiconductor, quartz, PCB, and optical substrate standards
- Strict commercial confidentiality and mutual NDA execution
Custom Technical Proposal Request
Submit your wet chemical process parameters to receive a tailored engineering quote.