High-Precision Custom Wet Process Stations
KOSEN SEMI provides custom wet process stations tailored for high-precision wafer-cleaning-systems and advanced semiconductor fabrication. Engineered to match your exact chemical workflows, cleanroom footprints, and process targets.
Corrosion-Resistant Build
Constructed with FM4910, PP, or PVDF materials for maximum chemical resistance.
Flexible Substrate Handling
Compatible with 4 to 12-inch wafers across manual, semi-auto, and fully automated setups.
OEM Wet Process Station Customization
From custom chemical bath selection to integrated SECS/GEM automation materials, every OEM wet station is precision-built for your exact semiconductor manufacturing workflow. Explore our robust Engineering Capability to see how we deliver tailored solutions.
Custom Bath Configuration & Fluid Dynamics
Each custom wet process station is designed around your specific substrate clean or etch sequence. KOSEN SEMI optimizes bath geometry, chemical recirculation, and agitation mechanisms to deliver ultra-clean wafer surfaces with minimized cross-contamination risk. Learn more about our advanced wafer-cleaning-systems designed for high-yield throughput.
- ✓Quartz Megasonic Bath
High-efficiency acoustic energy transfer (700 kHz–3 MHz) for 200 nm standard particle removal, optimized down to 100 nm, across 4-inch to 12-inch wafers while minimizing the risk of delicate pattern damage.
- ✓PTFE Constant-Temperature Acid Bath
Immersion heating with closed-loop PID control (±0.5°C accuracy) engineered for aggressive HF, H₂SO₄/H₂O₂ (SPM), and heated etch chemistries.
- ✓Quick Dump Rinse (QDR) Bath
High-flow bottom dump valves with dual top-spray manifolds for rapid chemical displacement and minimal DI water consumption.
- ✓IPA Vapor & N₂ Direct Drying Bath
Advanced Marangoni drying and surface-tension gradient technology designed to minimize watermarks on high-aspect-ratio microstructures.
Wafer Substrates
4″ – 12″ Wafers
Max Process Stations
Up to 20 Baths
Temp Uniformity
±0.5°C Control
Vessel Materials
PTFE / Quartz / PVDF
Tailored OEM Wet Station Engineering Built for Your Process
Every custom wet process station from KOSEN SEMI starts with detailed consultation. Our engineering team customizes bath configuration, chemical delivery systems, cleanroom footprint, and SECS/GEM control software around your exact fabrication goals—never forcing standard catalog compromises.
4″ – 12″
Wafer Compatibility
20+
Custom Bath Options
100%
SEMI S2 Compliant
Target Application Scenarios for Custom Wet Process Stations
Custom wet process stations from KOSEN SEMI are optimized for diverse substrates including Silicon, SiC, GaN, and Sapphire. Engineered to support specialized semiconductor wet bench applications, our tailored systems deliver precise surface conditioning, uniform chemical delivery, and uncompromised purity across critical fabrication, etching, and cleaning workflows. Explore our high-performance wafer-cleaning-systems to see how our engineering excellence drives yield improvements.
Advanced Packaging & MEMS
Delivering high-precision residue removal, isotropic etching, and uniform trench cleaning for complex 3D TSV structures and MEMS wet bench applications.
- Process Focus: High-aspect-ratio microstructure etching, sacrificial layer release, and deep trench surface conditioning.
- Megasonic Energy: Controlled acoustic cavitation energy for particle and organic residue removal at 200 nm standard capability, optimized down to 100 nm.
- Substrates: Silicon wafers, silicon-on-insulator (SOI), cavity substrates, and glass interposers.
Compound Semiconductors (SiC / GaN)
Engineered with extreme chemical resistance for severe acid and alkali chemistries required in SiC wet process and GaN power device manufacturing.
- Corrosion Resistance: Full PVDF, PTFE, and FM4910 fire-retardant construction for aggressive chemistry containment.
- High Thermal Tolerance: Heated acid baths with continuous recirculation for SPM, APM, and aggressive etching mixtures.
- Substrates: Silicon Carbide (SiC), Gallium Nitride (GaN), Sapphire, and GaAs wafers.
Universities & R&D Institutes
Flexible, multi-functional lab wet stations designed for low-volume, high-mix experimental research and pilot line prototyping.
- Modular Footprint: Compact, multi-chemical layout configured to maximize efficiency in constrained cleanroom spaces.
- Process Versatility: Manual and semi-automated options supporting multi-size (4", 6", 8") wafer processing.
- Safety Controls: Integrated dual-containment fluidics, automated interlocks, and local exhaust monitoring.
Wafer Recycling & PR Stripping
High-efficiency chemical processing stations tailored for photoresist (PR) stripping, sacrificial layer removal, and wafer reclaim routines.
- PR & Polymer Removal: Dedicated solvent and hot acid baths optimized for rapid, streak-free resist stripping.
- Metal Film Etching: Precision fluid agitation and thermal control for uniform thin-film metal stripping.
- Yield Protection: Integrated Quick Dump Rinse (QDR) and IPA drying modules to eliminate water spotting.
Substrate & Chemical Process Compatibility Matrix
Semiconductor wet processing requires strict chemical-material compatibility to prevent micro-contamination and safeguard equipment longevity. KOSEN SEMI engineers every custom wet process station with specialized tank materials, continuous inline chemical filtration, and precise temperature control engineered for demanding chemical formulations.
| Application Scenario | Primary Substrates | Key Process Chemistries | Recommended Station Features |
|---|---|---|---|
| Advanced Packaging / MEMS | Si, Glass, Interposers | KOH, TMAH, Solvent Strippers | Megasonic Agitation, N2 Bubbling, Overflow QDR |
| Compound Semiconductors (SiC/GaN) | SiC, GaN, Sapphire, GaAs | Hot H2SO4, H2O2, HF, HNO3, SPM | PTFE/PVDF Tanks, Dual Exhaust, Auto Fire Suppression |
| Lab & R&D Integration | 4" - 8" Multi-Substrate | BOE, SC-1, SC-2, Solvent Mixtures | Compact Modular Footprint, Multi-Recipe PLC Control |
| Wafer Rework & Reclaim | Silicon, Reclaim Wafers | PR Strippers, Metal Etchants, Piranha Solution | High-Temp Heated Acid Baths, Surface IPA Vapor Dryer |
High-Precision Process Control
Our wafer cleaning stations incorporate continuous inline chemical filtration, bath temperature stability within ±0.5°C, and automated dosing management. This ensures repeatable surface tension control, precise etch rates, and minimized particle re-deposition during critical semiconductor manufacturing steps.
SEMI S2 & FM4910 Compliance
Safety and reliability are engineered into every custom wet process station. Utilizing FM4910-certified fire-retardant thermoplastics and dual-walled containment systems, KOSEN SEMI equipment fully complies with international standards, including SEMI S2, SEMI S8, and CE.
Custom Wet Process vs. Standard Wet Bench
KOSEN SEMI eliminates cleanroom bottlenecks by delivering custom wet process stations precision-built for your chemical workflow.
| Comparison Dimension | Standard General Wet Bench | KOSEN Custom Wet Station Highlighted |
|---|---|---|
| Cleanroom Footprint Adaptation | Fixed standard dimensions force cleanroom layout compromises, creating dead space and restricting bay flow. | Tailored footprint designs maximize cleanroom space utilization and integrate seamlessly into your exact bay layout. |
| Chemical Recovery Efficiency | Basic gravity drainage leads to higher chemical dilution, excessive bath waste, and elevated consumable costs. | Dedicated fluid loops and automated chemical reclamation deliver superior recovery efficiency, slashing cost per wafer. |
| Recipe Flexibility | Rigid preset controls limit process optimization, slowing down advanced process development and line changes. | Fully programmable PLC and SECS/GEM architecture offer complete recipe flexibility for complex, multi-step sequences. |
| Safety Standard Compliance | Generic baseline safety options frequently require costly third-party retrofits to meet strict fab safety protocols. | Built with FM4910 fire-retardant materials and SEMI S2/S8 compliance directly out of the factory for zero-risk operation. |
Maximize Long-Term Cleanroom ROI
Although custom wet process stations require deeper upfront Engineering Capability consultation, they quickly recover capital expenditure by optimizing cleanroom real estate, reducing chemical consumption, and driving repeatable wafer yields.
Custom Wet Process Engineering Process
KOSEN SEMI executes structured design, modeling, and testing protocols for every custom wet process station to ensure seamless integration into semiconductor fabrication lines. From initial chemical compatibility audits to final site acceptance, our Engineering Capability team manages every technical milestone with precision.
Requirement Assessment and Chemical Audit
Deep evaluation of wet chemistry parameters, substrate compatibility, and fab facilities to establish a robust foundation for your custom wet bench architecture.
- Chemical profiling for HF, BOE, SPM, SC-1/SC-2, TMAH, and solvents
- Substrate validation for Si, SiC, GaN, InP, and Sapphire wafers
- Cleanroom utility mapping for UPW/DIW, chemical feed, drain, and exhaust
3D CAD Design and CFD Simulation
Advanced 3D layout modeling and computational fluid dynamics (CFD) simulations to optimize fluid recirculation, bath temperature uniformity, and exhaust extraction.
- 3D CAD modeling for modular bath layout and cleanroom footprint tuning
- CFD simulations for flow velocity, bath replacement, and agitation
- Exhaust airflow extraction optimized to satisfy SEMI S2 safety rules
Precision Manufacturing and Welding
High-purity cleanroom fabrication utilizing FM4910 fire-retardant thermoplastics, ultra-pure fluid manifolds, and integrated automated robotics control at our dedicated manufacturing facility.
- FM4910 plastic welding with NPP, PVDF, PTFE, and PFA materials
- Double-containment piping featuring secondary leak sensors
- PLC control integration supporting SECS/GEM fab automation protocols
FAT Testing and On-Site SAT Acceptance
Comprehensive validation protocols including factory wet runs, safety interlock audits, and cleanroom site acceptance testing with production wafers.
- In-factory FAT testing with DI water functional runs and leak checks
- Safety interlock audits covering emergency stop and exhaust pressure
- On-site SAT acceptance with test wafer yield verification
OEM Semiconductor Equipment Process
Every custom wet bench is engineered to meet specific cleanroom spatial constraints, aggressive chemical exposure parameters, and strict throughput goals.
Rigorous Quality Protocols at Every Engineering Milestone
The semi equipment OEM process requires uncompromised operational reliability when handling aggressive acid etch mixtures, elevated temperature chemical baths, megasonic agitation, and solvent stripping modules. KOSEN SEMI executes stringent quality control checks across each stage of the custom wet process engineering process to ensure high wafer yield and reduced unplanned downtime.
Through integrated 3D CFD fluid dynamics modeling, certified FM4910 cabinet construction, and detailed wet bench FAT SAT testing, semiconductor manufacturers receive custom wet process stations optimized for silicon wafer fabrication, third-generation compound semiconductor (SiC/GaN) processing, and MEMS production, including advanced wafer cleaning systems.
Engineering Process Deliverables and Validation Standards
| Workflow Milestone | Engineering Focus | Key Deliverable | Compliance / Test Standard |
|---|---|---|---|
| Phase 1: Analysis | Chemical compatibility & bath arrangement assessment | Process flow matrix & facility utility demand sheet | ISO Class 5–7 Cleanroom Standard |
| Phase 2: Modeling | 3D CAD design & CFD fluid dynamics simulation | Station layout blueprint & airflow extraction report | SEMI S2 & SEMI S8 Equipment Design Guidelines |
| Phase 3: Fabrication | FM4910 sheet welding & automated system assembly | Custom wet bench cabinet, baths & fluid manifolds | FM4910 Fire Retardant Material Certification |
| Phase 4: Acceptance | In-factory FAT testing & cleanroom SAT sign-off | Complete FAT/SAT validation package & O&M manuals | Full Process Yield & Operational Sign-Off |
SEMI S2 Certified Safe Chemical Processing Solutions
Built with FM4910 fire-retardant materials and adhering to SEMI S2 guidelines, KOSEN SEMI custom wet process stations prioritize cleanroom safety, operational reliability, and chemical compliance for demanding semiconductor environments. Discover our advanced wafer-cleaning-systems engineered to meet these rigorous standards.
Certified fire-retardant material designs engineered for cleanroom safety and minimal fire risk.
Comprehensive environmental, electrical, hazard mitigation, and ergonomic integration for semiconductor fabs.
Automated chemical leak sensors paired with real-time exhaust interlocks and emergency shutdowns.
Certified Quality & Trust Badges
Every KOSEN SEMI custom wet bench undergoes rigorous testing and audit verification to meet international cleanroom safety standards and factory compliance directives.
Verified Cleanroom Safety Standards
Engineered to prevent chemical exposure, thermal ignition, and operational hazards in high-volume production facilities.
Core Corrosion-Resistant Materials
Constructed with premium chemical-grade thermoplastics to withstand aggressive acids, bases, and solvents without degradation.
- NPP: Natural Polypropylene for high-purity chemical compatibility and DI water rinsing
- FM4910 PVC-C: Certified flame-retardant structural material for wet bench cabinets
- C-PVDF / PVDF: Static dissipative fluoropolymers ensuring ESD protection and solvent endurance
- PTFE / PFA: High-performance Teflon construction for aggressive, elevated-temperature acid processing
Safety & Standard Compliance
Precision engineered to comply with global semiconductor equipment guidelines and stringent environmental regulations.
- SEMI S2 Compliance: Comprehensive environmental, health, and safety design criteria
- SEMI S8 Ergonomics: Human factors design for safe operator interaction and maintenance
- CE Certification: Compliant with European health, safety, and environmental protection directives
- FM4910 Standard: Approved material flammability compliance for semiconductor cleanrooms
Core Active Safety Mechanisms
Real-time sensor arrays and integrated interlocks engineered for immediate response to process or fluid anomalies. Learn more about our high-precision Single Wafer Cleaning Systems for tailored safety integrations.
- Leak Detection: Continuous optical floor sensors and containment pan drip monitoring
- Dual Exhaust Interlock: Differential pressure monitoring with automatic chemical shutoff
- Auto Fire Suppression: Integrated N2 and CO2 extinguishing purges with flame sensors
- Emergency Off (EMO): Hardware-isolated safety circuit for instantaneous system shutdown
Request Your Custom Wet Process Station Quote
Contact about-us technical experts today to get a tailored proposal for your custom wet process station. Our engineering team provides dedicated support to match your specific cleanroom requirements, bath configurations, and throughput goals.