High-Standard Manufacturing Facility for Advanced Semiconductor Wet Process Equipment
Engineered with state-of-the-art cleanroom environments and ultra-precision machining, KOSEN SEMI delivers high-consistency, ultra-pure wet process tools for global semiconductor fabrication and advanced packaging clients. Learn more about our company focus and Engineering Capability to see how we drive manufacturing excellence.
Manufacturing Base
Cleanroom Production Line
Advanced Manufacturing Infrastructure for Semiconductor Wet Process Equipment
KOSEN SEMI integrates cleanroom assembly, precision machining, chemical delivery system integration, and factory validation processes to manufacture high-performance wet process equipment for semiconductor fabs, advanced packaging, and emerging wafer technologies.
Cleanroom Assembly
Controlled cleanroom environment for ultra-pure equipment assembly, contamination prevention, and semiconductor-grade process integration.
Precision Machining
High-precision machining capability for equipment frames, process chambers, fluid manifolds, and critical semiconductor components.
Chemical System Integration
Advanced fluoropolymer material integration for corrosive chemical applications including cleaning, etching, and stripping processes.
Factory Validation
Comprehensive factory acceptance testing, functional verification, and documentation preparation before equipment shipment.
Built for Reliable Semiconductor Production
From mechanical fabrication to cleanroom assembly and final validation, KOSEN SEMI provides complete manufacturing control to ensure equipment reliability, process consistency, and long-term fab operation stability.
Dust-Free Cleanroom & Assembly Environment
At KOSEN SEMI, all automated wafer cleaning systems, scrubber systems, and customized wet benches are built and qualified inside our controlled dust-free workshop environments. By enforcing ISO Class 5–7 cleanroom assembly protocols, continuous particle monitoring, and high-purity piping integration, we protect sensitive wet process components against micro-particulate contamination and organic outgassing long before equipment installation in client semiconductor fabs. Learn more about our company commitment on our about-us page.
ISO Class 5–7 Core Assembly Zone
Our controlled ISO Class 5–7 cleanroom provides an ultra-clean, micro-particle-controlled footprint dedicated to final tool integration. Designed specifically for semiconductor wet process equipment manufacturing, this environment maintains strictly regulated air velocity, relative humidity, and positive pressure differential to eliminate airborne particle contamination during critical mechanical and electrical assembly, backed by our advanced Engineering Capability.
Cleanroom Control & Assembly Capabilities
- • Climate and Humidity Control: Independent HVAC air handling units with HEPA filtration maintain precise temperature (22°C ± 0.5°C) and relative humidity (45% ± 5%) across positive pressure laminar flow bays.
- • Static Dissipative Flooring: Seamless conductive ESD epoxy flooring and grounded workstations prevent electrostatic charge accumulation during sensitive electronic and sensor installation.
- • Real-Time Particle Monitoring: Continuous laser particle counters stream live airborne particulate data to ensure uninterrupted ISO Class 5–7 cleanroom assembly compliance.
- • Precision Mechanical Integration: Cleanroom-certified assembly of quartz chemical baths, fluoropolymer process tanks, megasonic transducers, and multi-axis wafer transfer robotics.
Substrate Safety Assurance: By performing final tool integration inside an ESD-protected dust-free workshop, KOSEN SEMI guarantees that wet bench manifolds, chemical bath enclosures, and robotic handlers deliver pristine surface purity and controlled particle performance upon fab delivery.
Precision Machining & Quality Control System
KOSEN SEMI enforces rigorous quality control protocols across every stage of CNC precision machining, cleanroom assembly, and validation testing. To guarantee long-term operational stability in high-throughput semiconductor fab environments, every custom wet processing tool undergoes multi-gate verification from raw material intake to final Factory Acceptance Testing (FAT). Learn more about our overall Engineering Capability and manufacturing standards.
Our modern manufacturing base combines advanced multi-axis CNC precision machining with comprehensive particle generation tracking and fluid dynamics verification. This closed-loop quality chain eliminates micro-particle contamination risks and ensures ultra-pure chemical delivery under demanding etch, clean, and strip processing conditions across all our Automatic Wet Bench Systems.
Corrosion-Resistant Material Inspection
Spectroscopic analysis and chemical purity testing verify high-grade incoming polymers including PP-N, PVDF, PFA, and PTFE prior to manufacturing.
- Spectroscopic chemical purity analysis
- 100% material lot traceability tracking
- Outgassing and ionic contamination checks
Micron-Level CNC Machining
Sub-millimeter CNC precision machining shapes chemical-resistant tanks, bath bodies, and structural internal mechanisms within micron-level tolerances.
- Micron-threshold dimensional controls
- Ultra-smooth surface tank engraving
- Particle trap prevention design
Gas Tightness & Safety Testing
Comprehensive pressure helium leak detection, fluid circulation checks, and high-voltage insulation tests verify complete system integrity.
- 100% helium leak tightness detection
- High-voltage electrical insulation testing
- Strict SEMI S2 and SEMI S8 safety checks
Full-Function FAT Process Testing
Pre-shipment software logic validation, bath particle generation testing, and fluid dynamics uniformity checks replicate actual fab operations.
- Comprehensive semiconductor FAT testing
- In-bath particle generation count testing
- Fluid dynamics and flow uniformity audits
Rigorous QA Protocol for Semiconductor Benches
Semiconductor wet processing demands absolute fluid purity and seamless mechanical execution. At KOSEN SEMI, quality control begins long before tool assembly. By subjecting raw high-purity polymers to chemical spectroscopy and stress analysis, we guarantee that all process baths and piping networks withstand aggressive chemistries without outgassing or particle shedding across both automated and Manual Wet Bench Systems.
During CNC precision machining, automated coordinate measuring machines verify every dimension against design specifications. This precision eliminates micro-crevices where chemicals or micro-bubbles could accumulate, ensuring maximum yield stability during critical wafer cleaning, etching, and stripping steps.
| Inspection Gate | Testing Parameters | Quality Standard |
|---|---|---|
| Material Intake | Spectroscopic purity, polymer density | 100% Purity |
| CNC Machining | Tank dimensions, surface smoothness | Micron Tolerances |
| Safety & Tightness | Helium leakage, electrical insulation | SEMI S2 & S8 |
| FAT Process Validation | Particle count, fluid uniformity | Fab Ready |
Certifications & Industry Compliance
KOSEN SEMI manufacturing processes align with stringent global semiconductor standards to streamline customer audit approval. Learn more about our engineering capability across advanced production lines.
ISO 9001 Quality Management
Comprehensive quality management system covering production control, supplier management, process monitoring, and full component traceability throughout semiconductor equipment manufacturing.
Semiconductor Safety Compliance
Equipment design follows semiconductor industry safety requirements, supporting environmental protection, operator safety, and reliable fab integration.
CE & Electrical Safety Compliance
Electrical safety and EMC compliance support global deployment of semiconductor wet process equipment across international markets.
Need Official Audit Documentation?
Our quality team provides comprehensive compliance packages for fab qualification and procurement teams.